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The Miami System on Modules (SoM) are based on AMD state-of-the-art multicore computing platforms combining CPU, GPU, ML/AI and FPGA based processing. They deliver sophisticated embedded platforms for medium- and high-performance applications. The various SOM types provide best in class solutions by balancing silicon technology, size, performance, and power consumption. Depending on your application you can either choose for a SOM-as-board or for a SOM-as-IP solution, which integrate seamlessly with the carrier board.
Typical applications are found in the medical, industrial, avionics and test/measurement domains. The modules combine high performance and high-density programmable logic with dedicated hardened functionality, like DSP cores, ML/AI accelerators, memory controllers, PCIe endpoints and Ethernet MACs. This makes a Miami SOM a versatile and agile platform for various applications.
AMD SOC
Zynq Ultrascale+ ZU6, ZU9, ZU15
Processors
ARM Cortex-A53 Dual/Quad core
ARM Cortext-R5 Dual core
ARM Mali -400
Logic density
469k-747k cells
Connectors
2x 120 pins + 1x 180 pins
Gigabit transceivers
20
DDR Memory
1x 72bit / 4GB, 8GB
AMD SOC
Versal Versal Core (VC1902/1802/1702/1502)
Versal Edge (VE1752) and Versal Prime (VM1802/1502)
Processors
ARM Cortex A72 Dual core
ARM Cortex R5F Dual core
AI Engine
Logic density
up to 1968k cells
Connectors
Direct PCB interconnect
Gigabit transceivers
up to 44x, 32.75Gpbs per transceiver
DDR Memory
up to 4x 72bit (ECC) / 8GB, 16GB per bank
AMD SOC
Zynq 7035, 7045, 7100
Processors
ARM Cortex-A9 Dual core
Logic density
275k-444k cells
Connectors
2x120 pins + 1x 180 pins
Gigabit transceivers
16
DDR3 Memory
2x 32bit / 1GB
AMD SOC
Zynq 7012S, 7015, 7030
Processors
ARM Cortex-A9 Dual/Single core
Logic density
55k-125k cells
Connectors
2x 120 pins
Gigabit transceivers
4
DDR3 Memory
32bit / 1GB
The TOPIC Development kit is an evaluation platform, composed of a Florida carrier board in combination with an AMD Zynq® or Zynq Ultrascale+® based Miami System-on-Modules (SoM).
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